Temporary protective film for manufacturing semiconductor devices



Temporary protective film for manufacturing semiconductor devices

FIG. 1.1 is a perspective view of a temporary protective film for manufacturing semiconductor devices showing my design;

FIG. 1.2 is another perspective view thereof;

FIG. 1.3 is another perspective view thereof;

FIG. 1.4 is a front view thereof;

FIG. 1.5 is a back view thereof;

FIG. 1.6 is a top view thereof;

FIG. 1.7 is a bottom view thereof;

FIG. 1.8 is a left side view thereof;

FIG. 1.9 is a right side view thereof;

FIG. 1.10 is a sectional view thereof along lines A-A in FIG. 1.8.

The article includes a core part and a film part, and is characterized by the fact that the width of the core part is smaller than the width of the film part, and the film part is wound while partially protruding from the core part; each article is temporarily attached to a back of a lead frame when manufacturing a semiconductor device with only one side encapsulated and the lead frame on the back side exposed; the film part of each article has an adhesive layer on one side; since the core part does not protrude from the film part, each article can be easily positioned when set to equipment for manufacturing semiconductor devices, and it is possible to prevent the article from being misaligned when it is temporarily adhered to the back surface of the lead frame. The parallel thin lines in the representation represent contours only and do not illustrate an ornamentation or decoration on the surface of the product. 

CLAIM The ornamental design for a temporary protective film for manufacturing semiconductor devices, as shown and described. 